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SK hynix is evaluating a move to outsource a portion of its seventh-generation high-bandwidth memory base-die production to Intel Foundry. The company has relied entirely on TSMC for outsourced base-die production since the HBM4 generation, which currently employs a 12nm-class process.
The strategy aims to reduce supply-chain concentration and increase bargaining power as TSMC-produced base dies for HBM4 are estimated to cost three to four times more than DRAM core dies. Long-term supply agreements currently limit the company's ability to pass these costs to customers. SK hynix is also comparing Intel’s EMIB advanced packaging technology with TSMC’s CoWoS-S and CoWoS-L to support custom HBM tailored to specific AI accelerator architectures.
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Key sources
- SOURCE@jukan05“TSMC-produced base die used in HBM4 is estimated to cost three to four times as much as the core dies”x.com
- SUPPORT@bpaynews“multi-supplier strategy could ease supply risk and boost pricing leverage”x.com
- SOURCE@beth_kindig“capacity reaching 100K wafers annually at full scale”x.com
- SUPPORT@duhockeyfan“bringing key AI component production to the States”x.com