---
format: "aidr-story-markdown/v1"
id: "e1b478356ca56b733029193b0622015ad7dadbe9d08acbfefe2d5d0100bb3497"
canonical_url: "https://aidr.today/e1b47835?lang=en"
title: "SK hynix Diversifies HBM4E Base Die Supply With Intel, Ending Sole TSMC Use"
lang: "en"
requested_lang: "en"
available_langs: ["en","vi"]
translation_fallback: null
fallback_fields: []
published_at: "2026-08-31T02:39:20.000Z"
category: "Chips"
topics: ["sk-hynix","intel","tsmc","hbm","chips"]
source_urls: ["https://huggingnews.com/tech/update-sk-hynix-diversifies-hbm4e-base-die-supply-with-intel-ending-sole-413ccc6e","https://x.com/jukan05/status/2094234328230482082","https://x.com/bpaynews/status/2094236026289954920","https://x.com/Beth_Kindig/status/2094118175252107339","https://x.com/DUhockeyFan/status/2094080490105913828"]
summary: "SK hynix is evaluating a move to outsource a portion of its seventh-generation high-bandwidth memory base-die production to Intel Foundry. The company has relied entirely on TSMC for outsourced base-die production since the HBM4 generation, which currently employs a 12nm-class process. The strategy aims to reduce supply-chain concentration and increase bargaining power as TSMC-produced base dies for HBM4 are estimated to cost three to four times more than DRAM core dies. Long-term supply agreements currently limit the company's ability to pass these costs to customers. SK hynix is also comparing Intel’s EMIB advanced packaging technology with TSMC’s CoWoS-S and CoWoS-L to support custom HBM tailored to specific AI accelerator architectures."
---

# SK hynix Diversifies HBM4E Base Die Supply With Intel, Ending Sole TSMC Use

> [Open the canonical story](<https://aidr.today/e1b47835?lang=en>)

**Published:** 2026-08-31T02:39:20.000Z
**Category:** Chips
**Topics:** sk\-hynix, intel, tsmc, hbm, chips

## Summary

SK hynix is evaluating a move to outsource a portion of its seventh\-generation high\-bandwidth memory base\-die production to Intel Foundry\. The company has relied entirely on TSMC for outsourced base\-die production since the HBM4 generation, which currently employs a 12nm\-class process\. The strategy aims to reduce supply\-chain concentration and increase bargaining power as TSMC\-produced base dies for HBM4 are estimated to cost three to four times more than DRAM core dies\. Long\-term supply agreements currently limit the company's ability to pass these costs to customers\. SK hynix is also comparing Intel’s EMIB advanced packaging technology with TSMC’s CoWoS\-S and CoWoS\-L to support custom HBM tailored to specific AI accelerator architectures\.

## Sources

- [Story source](<https://huggingnews.com/tech/update-sk-hynix-diversifies-hbm4e-base-die-supply-with-intel-ending-sole-413ccc6e>)
- [Story source](<https://x.com/jukan05/status/2094234328230482082>)
- [Supporting source](<https://x.com/bpaynews/status/2094236026289954920>)
- [Story source](<https://x.com/Beth_Kindig/status/2094118175252107339>)
- [Supporting source](<https://x.com/DUhockeyFan/status/2094080490105913828>)