● FundingOct 29, 2026 · 21:538 sources
Wall Street to Issue $21B in Bonds for Record $63B Anthropic AI Chip Facility
From marketbrief.now
AI;DR
Bank of America, Citigroup and Morgan Stanley are preparing a high-grade bond offering of as much as $21B to fund the senior portion of a $63B debt facility for Anthropic, supporting a financing vehicle that will purchase AI accelerators and networking gear from Broadcom and lease them to the AI developer starting in 2027.
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- SUPPORT@business“Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package”x.com
- SUPPORT@edzitron“Blackstone losing every dollar on this deal - a negative EBITDA company... taking on - on top of $4.4bn of debt at 8.5% - billions in debt at *10%*”x.com
- SUPPORT@rohanpaul_ai“Private credit is getting more expensive, with Anthropic now offering Blackstone more than 10% on chip debt”x.com
- SUPPORT@kakashiii111“Wondering what Jensen is cooking up for the neoclouds' first aid package.”x.com
- SUPPORT@exec_sum“The AI startup was assigned BB+, the highest junk credit rating, by KBRA in June”x.com
- SUPPORT@tengyanai“blackstone takes $9B of the $18B junior tier, with fees pushing its yield above 10%.”x.com