--- format: "aidr-story-markdown/v1" id: "8bba0822f8ee4cab0c4e2f253b41e7690bde12793d822df0cbba63089f023a8a" canonical_url: "https://aidr.today/8bba0822?lang=en" title: "Wall Street to Issue $21B in Bonds for Record $63B Anthropic AI Chip Facility" lang: "en" requested_lang: "en" available_langs: ["en","vi"] translation_fallback: null fallback_fields: [] published_at: "2026-10-29T14:53:14.000Z" category: "Funding" topics: ["anthropic","funding"] source_urls: ["https://marketbrief.now/ai/wall-street-to-issue-21b-in-bonds-for-record-63b-anthropic-ai-chip-facil-fa428308","https://x.com/Reuters/status/2114832095222587830","https://x.com/PhotonCap/status/2114898224532406692","https://x.com/business/status/2115225816262951030","https://x.com/edzitron/status/2111262199872389375","https://x.com/rohanpaul_ai/status/2113146475249369212","https://x.com/kakashiii111/status/2115142587048968416","https://x.com/exec_sum/status/2111437603954200892"] summary: "Bank of America, Citigroup and Morgan Stanley are preparing a high-grade bond offering of as much as $21B to fund the senior portion of a $63B debt facility for Anthropic, supporting a financing vehicle that will purchase AI accelerators and networking gear from Broadcom and lease them to the AI developer starting in 2027." --- # Wall Street to Issue $21B in Bonds for Record $63B Anthropic AI Chip Facility > [Open the canonical story]() **Published:** 2026-10-29T14:53:14.000Z **Category:** Funding **Topics:** anthropic, funding ## Summary Bank of America, Citigroup and Morgan Stanley are preparing a high\-grade bond offering of as much as $21B to fund the senior portion of a $63B debt facility for Anthropic, supporting a financing vehicle that will purchase AI accelerators and networking gear from Broadcom and lease them to the AI developer starting in 2027\. ## Sources - [Story source]() - [Story source]() - [Story source]() - [Supporting source]() - [Supporting source]() - [Supporting source]() - [Supporting source]() - [Supporting source]()