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Xiaomi introduced a suite of in-house Xring processors and personal AI inference hardware capable of running 120B and 3B parameter models simultaneously. The lineup includes the 3nm O3 smartphone chip and D100 smart driving processor, alongside the O100 NPU which utilizes 6nm Wafer-on-wafer NPU-DRAM bonding with a 1.4µm pitch.
TSMC is manufacturing the chips as part of a strategic shift by Xiaomi to reduce its dependence on external suppliers Qualcomm and MediaTek. The company targets 200,000 to 300,000 units for its next flagship foldable device powered by the Xring O3.
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Key sources
- SOURCE@reuters“partners with TSMC for production”x.com
- SUPPORT@ftr_investors“200K–300K units targeted — reducing its reliance on Qualcomm and MediaTek”x.com
- SUPPORT@firstsquawk“Xring D100 3nm smart driving processor”x.com
- SUPPORT@jun_song“personal inference hardware that runs a 120B and a 3B model at the same time”x.com
- SUPPORT@teortaxestex“6nm, Wafer-on-wafer NPU-DRAM bonding with 1.4µm pitch”x.com
- SOURCE@dnystedt“adding the new chips mean lost sales for off-the-shelf chips like those made by Qualcomm and MediaTek”x.com
- SOURCE@neil_shah“Bonding pitch shrinks from ~50 μm all the way to 1.4 μm”x.com
- SUPPORT@zephyr_z9“This spec is extremely similar to Huawei's Logic Folding”x.com