---
format: "aidr-story-markdown/v1"
id: "77428eb03d15c0d2e6696b0d7563c268a3b93af51824cb34a41a6c554d891944"
canonical_url: "https://aidr.today/77428eb0?lang=en"
title: "Xiaomi Debuts 3nm Xring Chips with TSMC to Cut Reliance on Qualcomm and MediaTek"
lang: "en"
requested_lang: "en"
available_langs: ["en","vi"]
translation_fallback: null
fallback_fields: []
published_at: "2026-08-24T08:59:56.000Z"
category: "Chips"
topics: ["xiaomi","chips","inference","infra"]
source_urls: ["https://huggingnews.com/tech/xiaomi-debuts-3nm-xring-chips-with-tsmc-to-cut-reliance-on-qualcomm-and-0f7d04c5","https://x.com/Reuters/status/2091780075465158983","https://x.com/ftr_investors/status/2091784143570883012","https://x.com/FirstSquawk/status/2091778029932671419","https://x.com/jun_song/status/2091795576384106901","https://x.com/teortaxesTex/status/2091794713674186898","https://x.com/dnystedt/status/2092056239023047122","https://x.com/neil_shah/status/2091874398756278472"]
summary: "Xiaomi introduced a suite of in-house Xring processors and personal AI inference hardware capable of running 120B and 3B parameter models simultaneously. The lineup includes the 3nm O3 smartphone chip and D100 smart driving processor, alongside the O100 NPU which utilizes 6nm Wafer-on-wafer NPU-DRAM bonding with a 1.4µm pitch. TSMC is manufacturing the chips as part of a strategic shift by Xiaomi to reduce its dependence on external suppliers Qualcomm and MediaTek. The company targets 200,000 to 300,000 units for its next flagship foldable device powered by the Xring O3."
---

# Xiaomi Debuts 3nm Xring Chips with TSMC to Cut Reliance on Qualcomm and MediaTek

> [Open the canonical story](<https://aidr.today/77428eb0?lang=en>)

**Published:** 2026-08-24T08:59:56.000Z
**Category:** Chips
**Topics:** xiaomi, chips, inference, infra

## Summary

Xiaomi introduced a suite of in\-house Xring processors and personal AI inference hardware capable of running 120B and 3B parameter models simultaneously\. The lineup includes the 3nm O3 smartphone chip and D100 smart driving processor, alongside the O100 NPU which utilizes 6nm Wafer\-on\-wafer NPU\-DRAM bonding with a 1\.4µm pitch\. TSMC is manufacturing the chips as part of a strategic shift by Xiaomi to reduce its dependence on external suppliers Qualcomm and MediaTek\. The company targets 200,000 to 300,000 units for its next flagship foldable device powered by the Xring O3\.

## Sources

- [Story source](<https://huggingnews.com/tech/xiaomi-debuts-3nm-xring-chips-with-tsmc-to-cut-reliance-on-qualcomm-and-0f7d04c5>)
- [Story source](<https://x.com/Reuters/status/2091780075465158983>)
- [Supporting source](<https://x.com/ftr_investors/status/2091784143570883012>)
- [Supporting source](<https://x.com/FirstSquawk/status/2091778029932671419>)
- [Supporting source](<https://x.com/jun_song/status/2091795576384106901>)
- [Supporting source](<https://x.com/teortaxesTex/status/2091794713674186898>)
- [Story source](<https://x.com/dnystedt/status/2092056239023047122>)
- [Story source](<https://x.com/neil_shah/status/2091874398756278472>)