TSMC Plans Up to 20% Price Hike for CoWoS Advanced Packaging

TSMC plans to raise prices for its CoWoS advanced packaging by up to 20% as demand for AI hardware drives an 8-month lead time for semiconductor packaging equipment. The cost adjustment coincides with CoWoS adoption expanding beyond GPUs to server CPUs and custom ASICs, with monthly capacity estimated to exceed 130,000 wafers this year and reach 200,000 wafers by 2027.