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Samsung and SK Hynix are upgrading their NAND production facilities to produce 286-layer and 240-plus-layer chips respectively, aiming to counter YMTC's 38.5% market share lead in China's NAND market. Samsung targets 40,000 wafers monthly by December 2027 at its Xi'an plant under an internal project called Monami, while SK Hynix is upgrading its Dalian facility. Both companies state they are complying with US export rules despite a 2025 US Commerce Department statement against granting licenses for technology upgrades at foreign-owned Chinese fabs.
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Key sources
- SOURCE@reuters“upgrading their China factories to produce more advanced memory chips, aiming to fend off competition from a fast-growing Chinese rival and meet huge AI demand”x.com
- SUPPORT@choblin29“YMTC has overtaken Samsung in China's NAND market with a 38.5% share”x.com
- SUPPORT@rohanpaul_ai“converting its Xian plant, which produces about 40% of its global NAND, from roughly 200-layer chips to 286-layer V9 chips”x.com
- SUPPORT@openoutcrier“Samsung, SK Hynix upgrading China plants to make more advanced chips, people say”x.com
- SOURCEhuggingnewshuggingnews.com