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SK Hynix began construction Thursday on a high-bandwidth memory packaging facility in West Lafayette, Indiana, with mass production starting in the second half of 2029. The $4 billion site will package and test wafers produced in South Korea for domestic customers, supported by $458 million in CHIPS Act grants and $500 million in loans.
The facility marks a step in the US campaign to rebuild domestic supply chains for strategically important sectors. SK Hynix's chief executive officer forecasts that the global memory shortage will persist through the end of 2030, noting he sees no significant signals of a market downturn as AI demand continues to outrun new supply.
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Key sources
- SOURCE@reuters“SK Hynix to start AI chip output in Indiana in 2029”x.com
- SUPPORT@wallstengine“The project is backed by up to $458M in CHIPS Act funding and $500M in loans”x.com
- SUPPORT@business“marking a milestone in Washington’s expansive campaign to rebuild domestic supply chains”x.com
- SUPPORT@financialjuice“Expects memory shortage to continue through the end of 2030”x.com
- SUPPORT@financialjuice“Not seeing any significant signals of a memory downturn”x.com
- SUPPORT@stockmktnewz“held a groundbreaking ceremony today for its $4 Billion advanced memory packaging facility”x.com
- SUPPORT@stocksavvyshay“bringing a critical piece of the AI memory supply chain to the U.S.”x.com
- SUPPORT@firstsquawk“STARTS BUILDING A $4 BILLION MEMORY FACILITY IN INDIANA”x.com