---
format: "aidr-story-markdown/v1"
id: "3140b6631901b8df5b9b15225ebadb3d86c40df62a67cdfb9de92c34e0368082"
canonical_url: "https://aidr.today/3140b663?lang=en"
title: "SK Hynix Starts $4B Indiana Facility, First US HBM Packaging Base"
lang: "en"
requested_lang: "en"
available_langs: ["en","vi"]
translation_fallback: null
fallback_fields: []
published_at: "2026-08-27T20:55:33.000Z"
category: "Chips"
topics: ["chips","infra"]
source_urls: ["https://huggingnews.com/tech/sk-hynix-starts-4b-indiana-facility-first-us-hbm-packaging-base-8f46c498","https://x.com/Reuters/status/2093036314203476406","https://x.com/wallstengine/status/2093003167038591049","https://x.com/business/status/2093035916235358458","https://x.com/financialjuice/status/2093010841490632803","https://x.com/financialjuice/status/2093010896721183130","https://x.com/StockMKTNewz/status/2093000461125058750","https://x.com/StockSavvyShay/status/2093005874734547054"]
summary: "SK Hynix began construction Thursday on a high-bandwidth memory packaging facility in West Lafayette, Indiana, with mass production starting in the second half of 2029. The $4 billion site will package and test wafers produced in South Korea for domestic customers, supported by $458 million in CHIPS Act grants and $500 million in loans. The facility marks a step in the US campaign to rebuild domestic supply chains for strategically important sectors. SK Hynix's chief executive officer forecasts that the global memory shortage will persist through the end of 2030, noting he sees no significant signals of a market downturn as AI demand continues to outrun new supply."
---

# SK Hynix Starts $4B Indiana Facility, First US HBM Packaging Base

> [Open the canonical story](<https://aidr.today/3140b663?lang=en>)

**Published:** 2026-08-27T20:55:33.000Z
**Category:** Chips
**Topics:** chips, infra

## Summary

SK Hynix began construction Thursday on a high\-bandwidth memory packaging facility in West Lafayette, Indiana, with mass production starting in the second half of 2029\. The $4 billion site will package and test wafers produced in South Korea for domestic customers, supported by $458 million in CHIPS Act grants and $500 million in loans\. The facility marks a step in the US campaign to rebuild domestic supply chains for strategically important sectors\. SK Hynix's chief executive officer forecasts that the global memory shortage will persist through the end of 2030, noting he sees no significant signals of a market downturn as AI demand continues to outrun new supply\.

## Sources

- [Story source](<https://huggingnews.com/tech/sk-hynix-starts-4b-indiana-facility-first-us-hbm-packaging-base-8f46c498>)
- [Story source](<https://x.com/Reuters/status/2093036314203476406>)
- [Supporting source](<https://x.com/wallstengine/status/2093003167038591049>)
- [Supporting source](<https://x.com/business/status/2093035916235358458>)
- [Supporting source](<https://x.com/financialjuice/status/2093010841490632803>)
- [Supporting source](<https://x.com/financialjuice/status/2093010896721183130>)
- [Supporting source](<https://x.com/StockMKTNewz/status/2093000461125058750>)
- [Supporting source](<https://x.com/StockSavvyShay/status/2093005874734547054>)