Intel Wins SK Hynix and Google for Packaging in First Direct Challenge to TSMC CoWoS

The company's EMIB advanced packaging is gaining traction with Apple and MediaTek as chip designers seek to diversify their supply chains away from TSMC. Intel reported at a Deutsche Bank conference that 18A yields are tracking ahead of targets and 14A defect density is the best it has seen since the 22nm node.

The packaging business serves as a strategic entry point to win broader wafer foundry opportunities, with EMIB-T ramping in the second half of 2027. Intel forecasts a 40% gross margin and 30% operating margin for the advanced packaging segment, while MediaTek's EMIB solution has already met Google's requirements for technology and cost.