---
format: "aidr-story-markdown/v1"
id: "080ca0b82766b6b1226c304a1d35e29ed56d2def3dd3df9f286074888a03cd09"
canonical_url: "https://aidr.today/080ca0b8?lang=en"
title: "Intel Wins SK Hynix and Google for Packaging in First Direct Challenge to TSMC CoWoS"
lang: "en"
requested_lang: "en"
available_langs: ["en","vi"]
translation_fallback: null
fallback_fields: []
published_at: "2026-08-27T11:43:30.000Z"
category: "Industry"
topics: ["intel","google","apple","chips","infra"]
source_urls: ["https://huggingnews.com/tech/update-intel-wins-sk-hynix-and-google-for-packaging-in-first-direct-chal-3f099652","https://x.com/Aaronwei3n/status/2092918087687569700","https://x.com/dnystedt/status/2092783136027627695","https://x.com/jukan05/status/2092786880920297611"]
summary: "The company's EMIB advanced packaging is gaining traction with Apple and MediaTek as chip designers seek to diversify their supply chains away from TSMC. Intel reported at a Deutsche Bank conference that 18A yields are tracking ahead of targets and 14A defect density is the best it has seen since the 22nm node. The packaging business serves as a strategic entry point to win broader wafer foundry opportunities, with EMIB-T ramping in the second half of 2027. Intel forecasts a 40% gross margin and 30% operating margin for the advanced packaging segment, while MediaTek's EMIB solution has already met Google's requirements for technology and cost."
---

# Intel Wins SK Hynix and Google for Packaging in First Direct Challenge to TSMC CoWoS

> [Open the canonical story](<https://aidr.today/080ca0b8?lang=en>)

**Published:** 2026-08-27T11:43:30.000Z
**Category:** Industry
**Topics:** intel, google, apple, chips, infra

## Summary

The company's EMIB advanced packaging is gaining traction with Apple and MediaTek as chip designers seek to diversify their supply chains away from TSMC\. Intel reported at a Deutsche Bank conference that 18A yields are tracking ahead of targets and 14A defect density is the best it has seen since the 22nm node\. The packaging business serves as a strategic entry point to win broader wafer foundry opportunities, with EMIB\-T ramping in the second half of 2027\. Intel forecasts a 40% gross margin and 30% operating margin for the advanced packaging segment, while MediaTek's EMIB solution has already met Google's requirements for technology and cost\.

## Sources

- [Story source](<https://huggingnews.com/tech/update-intel-wins-sk-hynix-and-google-for-packaging-in-first-direct-chal-3f099652>)
- [Supporting source](<https://x.com/Aaronwei3n/status/2092918087687569700>)
- [Story source](<https://x.com/dnystedt/status/2092783136027627695>)
- [Supporting source](<https://x.com/jukan05/status/2092786880920297611>)