Samsung's Planned 2nm Texas Foundry Is Fully Booked for HBM Logic Chips

The chipmaker's newest facility in Taylor will start receiving production equipment in 2029, with mass manufacturing of semiconductors slated to begin a year later. The plant's 2nm process line, used to create the base logic layers for high bandwidth memory (HBM) stacks, is already fully reserved for contracts with Nvidia and AMD.

AMD is expected to account for the majority of the fab's output for its next-generation HBM components, which now require advanced foundry nodes rather than traditional DRAM processes to maintain speed. While Nvidia has also secured capacity at the site, the company continues to use TSMC for its custom HBM base die needs.