Coherent Samples 300mm SiC Substrates to Boost AI Heat Spreading 25% to Monetize Beyond Optics

A new thermal management platform is being tested by major chipmakers to alleviate the heat dissipation constraints that currently limit system performance in high density data centers. Coherent provided these 300mm high thermal conductivity silicon carbide (SiC) substrates to partners to improve heat spreading by up to 25% while maintaining compatibility with standard semiconductor manufacturing.

The company is leveraging its vertically integrated capabilities in SiC crystal growth and wafering to scale for high volume production. This move allows the firm to capture more AI infrastructure spending from developers like Nvidia, AMD, and Broadcom by expanding its offerings beyond its traditional optics business.