GlobalFoundries Signs $2B TSMC Deal to Make First US AI Interposers

GlobalFoundries and TSMC have signed a $2 billion, five-year contract to produce silicon interposers at a New York site, establishing the first domestic source of this AI packaging component. Volume production is expected to ramp in the first half of 2028, and the agreement allows TSMC to procure the hardware within the United States for the first time.