← Back to live feed1 story
Volume production for Micron's HBM4E memory using 1-gamma DRAM is targeted for 2027. Reports from supply chain sources indicate the company is looking to test hybrid bonding on the HBM4E 12Hi variant, pulling the technology forward from the original HBM5 12Hi plan, though the timeline for ramping production remains unclear.
The shift allows Micron to expedite advanced packaging development on its next-generation memory node. This strategy aligns with a growing industry focus where packaging technology is treated as a critical competitive factor alongside underlying memory node shrinks for high-bandwidth performance.
Sign in to suggest edits
Key sources
- SOURCE@pequityresearch“Micron is looking to test HBM4E 12Hi with hybrid bonding, but ramp remains unclear”x.com
- SUPPORT@itsbenvale“Micron has confirmed that HBM4E will use 1γ DRAM, with volume production targeted for 2027”x.com
- SUPPORT@jukan05“Original plan was to do it for HBM5 12Hi, but the company is looking to expedite it on 1gamma”x.com