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The South Korean chipmaker is studying a joint venture for a memory plant in Japan to increase capacity for high-bandwidth memory (HBM) and NAND. Site selection depends on access to water and power to bring production closer to Japanese customers and suppliers.
SK Group Chairman Chey Tae-won said customers seek 60% to 100% more AI memory in 2027 than in 2026. The proposed project adds to growth plans that include a $39B buildout in Korea and a $4B packaging facility in Indiana.
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Key sources
- SOURCE@business“partnership to Supply AI Boom”x.com
- SUPPORT@beth_kindig“customers are seeking 60-100% more AI memory from SK Hynix $SKHY in 2027 compared to 2026”x.com
- SUPPORT@wallstengine“a ~$39B capacity buildout in Korea and a $4B advanced memory packaging facility in Indiana”x.com
- SUPPORT@stocksavvyshay“AI demand continues to force capacity expansion closer to power, water and customers”x.com