TSMC Weighs Next-Generation Memory Production to Create Fourth AI Chip Source for Nvidia

TSMC has reportedly begun drafting designs for vertical-stack memory cells to help its largest client mitigate a global shortage of hardware. TSMC is exploring the production of 3D DRAM to provide Nvidia with a fourth supplier for advanced memory, an effort led by Vice President Hsu Kuo-chin that would put the company in direct competition with Samsung, SK Hynix, and Micron. A TSMC spokesperson has denied the report, stating the company remains a pure-play logic foundry and intends to maintain that strategic focus.