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Huawei đã công bố kế hoạch ra mắt chip AI Ascend 960 cùng cụm NPU quy mô 1 triệu thiết bị vào năm 2027, đánh dấu bước tiến lớn trong chiến lược phát triển AI của hãng.
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Nguồn chính
- SOURCE@reuters“launch two new artificial-intelligence semiconductors in 2027, rotating chairman David Wang said, as the Chinese tech giant builds up its AI computing business and seeks to challenge US chipmaker Nvidia”x.com
- SUPPORT@maxforai“昇腾 960 芯片已经提前就绪，整体性能将实现翻番”x.com
- SUPPORT@wallstengine“shipped 1,000+ supernode systems to 370+ customers and says its supercluster architecture can scale to 1 million NPUs”x.com
- SOURCE@sino_market“Hi-ONE, built on its proprietary technologies with a balanced optics/mechanics/electronics/magnetics/thermal design, delivers 7.2T transmission capacity per engine”x.com
- SUPPORT@poezhao0605“5,500 Hi-ONE engines replace 48,000 800G optical modules”x.com
- SUPPORT@mark_k“UnifiedBus, an architecture designed to connect up to ONE MILLION processors into a single AI supercluster”x.com
- SUPPORT@business“advancing its ambition to replace Nvidia in China and compete on the global stage”x.com
- SUPPORT@techmeme“Ascend 960DT AI chip in Q1 2027 and the 960PR in Q3 2027”x.com